CIT Co.Ltd

  • Location

    Hall 7 Stand 7A62

Information

CIT (Copper Innovation Technology) is pioneering the next era of Artificial Intelligence with ultra-flat copper and beyond-copper thin-film deposition.
Using our proprietary Atomic Sputtering Epitaxy (ASE), we deliver high-performance solutions that enhance speed, reliability, and scalability across AI-driven applications.
CIT partners with global innovators in computing, mobility, and connectivity.
Our mission is simple yet powerful: transform advanced materials into smarter, faster, and more sustainable technologies that empower AI-driven societies worldwide.