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xMEMS Labs Inc.
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Location
Hall 7 Stand 7G20
Information
Company profile
Founded in 2018, xMEMS Labs, Inc. is redefining sound and cooling with its breakthrough piezoMEMS platform. We created the world’s first solid-state MEMS speakers—powering AI glasses, earbuds, headphones, and smartwatches—and the first μCooling fan-on-a-chip, enabling improved thermal performance in smartphones, AI glasses, SSDs, and beyond. xMEMS has over 250 granted patents worldwide for its technologies.
Products & Services
xMEMS Labs, Inc. develops solid-state microelectromechanical systems (MEMS) semiconductors and is focused on innovations in piezoMEMS ultrasonic actuators and transducers. xMEMS currently applies its novel and patented solid-state, silicon piezoMEMS process to three core markets: 1) Active micro cooling chip (fan-on-a-chip) delivering critical thermal management to small, thin systems such as smartphones, XR, SSD storage and datacenter subsystems that conventional fans and liquid cooling cannot reach, 2) loud speakers for near-field audio products such as smart watches and open-fit earbuds, and 3) micro speakers for earbuds, headphones and hearing assistance devices.
Founded in 2018, xMEMS Labs, Inc. is redefining sound and cooling with its breakthrough piezoMEMS platform. We created the world’s first solid-state MEMS speakers—powering AI glasses, earbuds, headphones, and smartwatches—and the first μCooling fan-on-a-chip, enabling improved thermal performance in smartphones, AI glasses, SSDs, and beyond. xMEMS has over 250 granted patents worldwide for its technologies.
Products & Services
xMEMS Labs, Inc. develops solid-state microelectromechanical systems (MEMS) semiconductors and is focused on innovations in piezoMEMS ultrasonic actuators and transducers. xMEMS currently applies its novel and patented solid-state, silicon piezoMEMS process to three core markets: 1) Active micro cooling chip (fan-on-a-chip) delivering critical thermal management to small, thin systems such as smartphones, XR, SSD storage and datacenter subsystems that conventional fans and liquid cooling cannot reach, 2) loud speakers for near-field audio products such as smart watches and open-fit earbuds, and 3) micro speakers for earbuds, headphones and hearing assistance devices.